Titan Spine, a medical device surface technology company focused on the development of spinal interbody fusion implants, announced that it has acquired two patents related to its current and future surface modification techniques.
The first patent protects the company’s existing manufacturing process that has been shown to produce superior bone-forming activity when compared to standard PEEK and titanium implant materials during in-vitro cellular studies and has been commercially available in the United States since 2006. The second patent protects Titan Spine’s next-generation surface technology that further refines its nano features, which the company expects to produce an even more robust osteogenic response.
Barbara Boyan, Professor of Biomedical Engineering at the Institute for Bioengineering and Bioscience, Georgia Institute of Technology, is conducting in-vitro cellular studies on the company’s newer surface. She commented, “Nano technology is beginning to come to the forefront of the spinal industry. Even small modifications to the surface of a spinal implant at the micro and nano levels can have a profound effect on the biological response to the device, which, in turn, can influence the patient’s surgical outcome. Titan Spine has been pioneering this effort for many years and is continuing to evolve surface modification techniques to elicit increasingly beneficial results.”
“The acquisition of these two patents is important to the company on several fronts,” said Kevin Gemas, president, Titan Spine. “Not only does it significantly strengthen our intellectual property profile and protect our next-generation surface through 2023, but it also demonstrates our commitment to the growing belief in the spinal industry that interbody devices should do more than just act as a spacer in a marketplace where spine surgeons are increasingly being forced to change from their biologic material of choice. And lastly, but perhaps most important of all, these acquisitions create the potential for us to apply our scientific and manufacturing know-how to other medical device applications.”